报告人：Huey Tyng Cheong（马来西亚双威大学数学科学学院）

报告时间：2024年3月22日10:00

报告地点：东校区3201

报告摘要：Electricalappliances and electronic devices with compact designs are trending nowadays.However, there is always a drawback for electronic devices is the heatgeneration during operation, in which excessive heat generated might lead tomalfunction of the device or even worse. Hence, developing electronics withhigh performance and yet effective cooling is crucial. Therefore, understandingthe phenomena of fluid flow and heat transfer processes in enclosures isimportant in many engineering and industrial applications, as most electricalappliances and electronic devices are confined within their outer container.The geometry of the system, that is, the shape and size of the enclosure andboundary wall temperatures, can be the factors that provide optimal heattransfer for various engineering applications. Hence, the effects of theenclosure’s shape and aspect ratio will be the subjects of the present study. Aporous enclosure filled with fluid is considered. The enclosure’s left sidewall is heated at a higher temperature while the right side wall is cooled at alower temperature. The top and bottom walls are insulated. The governing equationsand boundary conditions are derived from the proposed physical model. Thegoverning system of partial differential equations is non-dimensionalized,using suitable dimensionless variables to reduce the complexity of physicalquantities involved in solving the system. An appropriate numerical algorithmis developed to find the numerical solutions of heat transfer and fluid flow inthe enclosures. This study will provide new understanding and algorithms thatbenefit engineering application designs.

报告人简介：HueyTyng Cheong, 博士，马来西亚双威大学数学科学学院副院长、数学精算科学负责人。2017年博士毕业于马来亚大学数学专业。主持马来西亚高等教育部等项目7项，指导博士生2名，硕士生10余名。在《Journalof Optimization Theory and Applications》、《Numerical HeatTransfer》、《InternationalCommunications in Heat and Mass Transfer》等国际著名学术期刊上发表论文20余篇，2019年获马来西亚双威大学杰出研究奖。